| 摘要 |
PROBLEM TO BE SOLVED: To realize and provide a semiconductor of multi-chip constitution incorporating an insulation barrier, having high insulation property inside of a package or a module and a small application circuit IC of a small mounting area using this semiconductor. SOLUTION: The external electrodes pressure-resistant capacitors formed on multiple semiconductor chips are connected electrically by a wire bonding or a printed board wiring, a lead frame, etc. Then, a driver circuit, for signal transmission of a receiver circuit for signal reception formed on the semiconductor chip, is connected electrically with electrodes on the side of the substrates of the pressure-resistant capacitors for housing the multiple semiconductor chips in a single package or in a single module. Thus, insulation property and miniaturization of the semiconductor device are made compatible. |
