发明名称 INTEGRATED PASSIVE ELEMENT FOR HIGH-FREQUENCY COMMUNICATION MANUFACTURED BY APPLYING MICRO ELECTRO- MECHANICS
摘要 PROBLEM TO BE SOLVED: To provide a manufacturing process and materials for a hybrid communication element which is inexpensive and highly reliable by using in combination an integrated passive element for high-frequency communication and a passive element with relatively low precision obtained by co-burning ceramic at a low temperature by applying micro electro-mechanics. SOLUTION: The design method, materials and manufacturing process for the hybrid communication element are provided, the range of available frequencies is 0.9 to 100 GHz, and the requirements of small circuit area and low cost are met; and the basic structure of the passive element is a two-layered substrate and may have a lower layer of ceramic and an upper layer of transparent plastic and have an additional one-layered ceramic substrate as the bottom layer. The materials and temperature of the whole process are all compatible with a manufacturing process for a CMOS, and may be a subsequent manufacturing process of an RF-CMOS; and a method for isolation between elements is provided for the design and manufacture of the elements and coupling between the elements and an interference phenomenon are greatly suppressed to improve the efficiency of integration and miniaturization.
申请公布号 JP2002270462(A) 申请公布日期 2002.09.20
申请号 JP20010350694 申请日期 2001.11.15
申请人 RENKAI KAGI YUGENKOSHI 发明人 CHANG PEI-ZEN;HUANG JUNG-TANG;YO SOHO
分类号 B81B3/00;B81C1/00;H01C7/00;H01F17/00;H01G4/33;H01H59/00;H01Q1/38;H03H7/01;H05K1/03 主分类号 B81B3/00
代理机构 代理人
主权项
地址