发明名称 LAMINATE STRUCTURE OF BOARD
摘要 <p>PROBLEM TO BE SOLVED: To provide a laminate structure of a board which educes the influence of a heating component and radiation heat from the board on a control component and a control board. SOLUTION: The board laminate structure having a board 21 mounting the heating components 27, 28 and the control board mounting the control components 51, 52 with specified distances left therebetween holds the board 21 and the control board to with the specified distance through hold plates 33 with a heat insulation plate 38 inserted between the bards 21, 50 and with air layers S formed between the heat insulation plate 38 and the control board 50.</p>
申请公布号 JP2002270982(A) 申请公布日期 2002.09.20
申请号 JP20010069074 申请日期 2001.03.12
申请人 YAZAKI CORP 发明人 ASHIYA HIROYUKI;TANAKA YOSHIYUKI;MAKI YAYOI
分类号 H05K7/20;B60R16/02;B60R16/023;H02G3/16;H05K1/14;(IPC1-7):H05K1/14 主分类号 H05K7/20
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