| 摘要 |
PROBLEM TO BE SOLVED: To remarkably increase workability of filling and productivity of a component, enable perfect filling of a gap with an underfill material and enable mounting of other electronic components on a substrate with high efficiency and high density, in an electronic component which is connected with the substrate via colder bumps and in which the gap between the substrate and the component is filled with the underfill material. SOLUTION: One surface side of an electronic component body 11 is coated with an underfill material 13 so as to expose tips of the solder bumps 12 arranged on the electronic component body 11. From a viewpoint for more stiffly attaching an electronic component 1 on the substrate, a side face of the electronic component body 11 may be coated further with the underfill material 13.
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