| 摘要 |
PROBLEM TO BE SOLVED: To provide a socket for a semiconductor package wherein an inconvenience caused by the fact that an electric conductor catches on the semiconductor package is prevented and its attachment/detachment is facilitated. SOLUTION: This is the socket for the semiconductor package 1 equipped with a substrate 2 and electric conductors 3 consisting of plural coil springs so that the electric conductors 3 are electrically connected with terminals 13 of the semiconductor package 12. An insulating substrate 4 having plural through-holes 10 corresponding to the electric conductors 3 via a driving member 9 driving in a separating direction from one side of the substrate 2 is arranged and installed at a face of the one side of the substrate 2. Plural electrically conducting layers 7 are installed at a face of the other side of the substrate 2. The electric conductors 3 have their one end side made to be inserted into and communicated with the through-holes 10 of the insulating substrate 4 while having their another end sides connected with the electrically conducting layers 7, and the electric conductors 3 are arranged and installed so that end parts of their one end sides are in a state of being embedded into the through-holes 10 of the insulating substrate 4 when the insulating substrate 4 is driven by the driving member 9 to be separated from the substrate side 2.
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