发明名称 LIGHT EMITTING DIODE AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To solve the problem that an LED deteriorates in brightness because light emitted from the LED leaks in the lateral direction, penetrating through a light transmitting board. SOLUTION: Through-holes are provided in rows on an aggregate board, and a stepped through-hole 1b with a recess 1a is provide between the rows of the through-holes. An upper electrode 3, a lower electrode 4, and a through- hole electrode 2 (conductive part) are provided on the board, the rear opening of the through-hole 1b is stopped up with a tape or the like, then light transmitting resin fills up the through-hole and is cured, an LED 7 is die-bonded on the light transmitting resin 11 with light transmitting die bonding paste 8 covering the side of the LED 7, the LED 7 is wire-bonded with metal fine wires 9, and sealing resin 10 is made to fill up the recess 1a so as to cover the LED 7 and the metal fine wires 9. Cut lines are provided passing through centers of the through-holes, and other cut lines are provided crossing the cut lines at right angles, the aggregate board is cut into unit light emitting diodes along the latter cut lines. The through-holes are sloped, and a reflecting film is formed on the slope. The light emitting diodes can be improved in brightness and made inexpensive because they are thin and formed in a lot.
申请公布号 JP2002270901(A) 申请公布日期 2002.09.20
申请号 JP20010069512 申请日期 2001.03.12
申请人 CITIZEN ELECTRONICS CO LTD 发明人 NAGAYAMA MAKOTO
分类号 H01L33/46;H01L33/54;H01L33/56 主分类号 H01L33/46
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