WIRING BOARD AND ITS MANUFACTURING METHOD, SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD, AND CIRCUIT BOARD AND ELECTRONIC APPARATUS

摘要

PROBLEM TO BE SOLVED: To provide a wiring board which can be provided easily with conductive material in its through hole, and its manufacturing method, to provide a semiconductor device and its manufacturing method, and to provide a circuit board and an electronic circuit apparatus. SOLUTION: The manufacturing method for a semiconductor device includes a step for providing conductive material 40 on the side of a first face 30 of the through hole 24 made in a semiconductor element 10, and fusing the conductive material 40 to flow in the through hole 24. The conductive material 40 is let flow in the through hole 24 on condition that the pressure on the side of the second face 32 opposite to the first face 30 is lowered than the pressure on the side of the first face 30 of the semiconductor element 10.