发明名称 |
MANUFACTURING METHOD FOR LARGE-GRAIN POLYCRYSTALLINE FILM |
摘要 |
<p>PROBLEM TO BE SOLVED: To provide a large-grain polycrystalline film manufacturing method which suppresses any abnormal separation of a polycrystalline film silicon from a substrate to reduce the damage caused to both. SOLUTION: The large-grain polycrystalline film manufacturing method comprises a first step of forming a first insulation film, a first semiconductor film and a second insulation film in this order on a substrate; a second step of melt-recrystallizing the first semiconductor film covered with the second insulation film; a third step of removing the second insulation film to expose the first semiconductor film melt-recrystallized to enlarge the grain size; a fourth step of epitaxially growing a second semiconductor film on the exposed first semiconductor film; and a fifth step of forming through-holes into the second and first semiconductor films, and etching off the first insulation film to separate the second and first semiconductor films from the substrate. The substrate uses a single crystal silicon of an orientation plane (111).</p> |
申请公布号 |
JP2002270506(A) |
申请公布日期 |
2002.09.20 |
申请号 |
JP20010070350 |
申请日期 |
2001.03.13 |
申请人 |
MITSUBISHI ELECTRIC CORP |
发明人 |
MATSUNO YOSHINORI;MORIKAWA HIROAKI |
分类号 |
H01L31/04;H01L21/20;H01L29/786;(IPC1-7):H01L21/20 |
主分类号 |
H01L31/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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