COIL-INCORPORATED MULTI-LAYER SUBSTRATE AND ITS MANUFACTURING METHOD, AND MANUFACTURING METHOD FOR LAMINATED COIL

摘要

PROBLEM TO BE SOLVED: To efficiently manufacture a coil-incorporated multi-layered resin board which has a relatively large-sized coil. SOLUTION: A coil-incorporated multi-layered resin 29 is formed by laminating insulating resin layers 36 alternately with coil patterns 37 and uniting them together by heating and pressing them, and the coil patterns 37 of respective layers are electrically connected by a via hole conductor 38 formed penetrating the respective insulating resin layers 36. Each insulating resin layer 36 is formed of mixed resin of 65 to 35 wt.% polyaryl ketone resin of >=260 deg.C in crystal fusion peak temperature and 35 to 65 wt.% polyether imide as a crystallized delay polymer. The coil patterns 37 are formed by a subtractive method. The via hole conductor 38 is formed by charging conductor paste in the via hole 39 formed in the insulating resin layers 36 by screen printing.