MOUNTING STRUCTURE AND METHOD OF MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a mounting structure suing the technology to increase the adhesive strength of a conductive adhesive to an equivalent level of that of solder and obtain a connection reliability larger than by soldering. SOLUTION: An electronic component 1 is electrically connected to a board 2 via a conductive paste. At electric connections between a component electrode 3 of the electronic component 1 or board electrode 4 of the board 2 and a conductive filler 5a inside the conductive paste 5, a metal of the conductive filler 5a and a metal of the electrode 3 or 4 are alloyed.