| 摘要 |
PROBLEM TO BE SOLVED: To provide an efficient and reliable method of manufacturing a semiconductor wafer without metal contamination, by which, when a semiconductor wafer surface is etched or cleaned, the metal concentration of the wafer surface to be manufactured is not directly analyzed, but an analytical value is indirectly and instantly obtained and regulated to make the value below a predetermined value, and to provide a device for monitoring the same. SOLUTION: In a method of manufacturing a semiconductor wafer, the metal concentration of the wafer surface to be manufactured is regulated by regulating the metal concentration in a liquid directly brought into contact with the wafer so that the value is below a predetermined value in a process of manufacturing a semiconductor wafer, and a metal monitoring device used for this method.
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