摘要 |
<p>A method for treating a thermoplastic resin composition containing an additive, which comprises heating and agitating the thermoplastic resin composition containing an additive together with a solvent capable of dissolving at least a part of the additive at a temperature being not lower than the glass transition temperature of the thermoplastic resin and not higher than the boiling point of the solvent, and separating and recovering the resultant solvent containing at least a part of the additive dissolved therein in a liquid state, to thereby separate and remove at least a part of the additive from the thermoplastic resin composition. The method can be employed for separating an additive component and a resin component of a thermoplastic resin composition containing an additive, with good efficiency, in order to treat and reuse the resin composition.</p> |
申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.;NAKAJIMA, KEIZO;KAWAKAMI, TETSUJI;ONISHI, HIROSHI;UENO, TAKAYOSHI;TERADA, TAKAHIKO |
发明人 |
NAKAJIMA, KEIZO;KAWAKAMI, TETSUJI;ONISHI, HIROSHI;UENO, TAKAYOSHI;TERADA, TAKAHIKO |