Semiconductor module in which plural semiconductor chips are enclosed in one package

摘要

A semiconductor module includes first and second semiconductor chips having first and second element surfaces where first and second electrode pads are provided. The first semiconductor chip is provided on a second main surface of a substrate with the first element surface facing the substrate. The second semiconductor chip is provided on the first semiconductor chip with a surface opposite to the second element surface facing a surface opposite to the first element surface. First and second wiring patterns are provided on the first and second main surfaces and connected to each other. The first and second wiring patterns have first and second connection parts. First and second connection wire connect the first and second electrode pads to the first and second connection parts respectively. An external terminal is provided on the first wiring pattern. A sealing member covers the second connection wire.