发明名称 Leiterbahnanordnung und Verfahren zur Herstellung einer Leiterbahnanordnung
摘要 A conductor track arrangement (100) comprises, on a first layer (101), a first layer surface (102) and at least two conductor tracks (104), which are arranged on the first layer surface and which have a second layer surface (105) that is essentially parallel to the first layer surface (102). A second layer (106) is arranged on the second layer surface of each conductor track (104), whereby the second layers (106) of adjacent conductor tracks overlap areas located between the adjacent conductor tracks (104). A third layer (107) is arranged on said second layer and completely occludes the areas located between the adjacent conductor tracks (104) by overlapping the same.
申请公布号 DE10109877(A1) 申请公布日期 2002.09.19
申请号 DE2001109877 申请日期 2001.03.01
申请人 INFINEON TECHNOLOGIES AG 发明人 SCHINDLER, GUENTHER;ENGELHARDT, MANFRED
分类号 H01L21/768;H01L23/522;H01L23/532;(IPC1-7):H01L23/522 主分类号 H01L21/768
代理机构 代理人
主权项
地址