发明名称 LOW INDUCTANCE CHIP WITH CENTER VIA CONTACT
摘要 A multi-layer ceramic capacitor (MLC) device (10) for low inductance decoupling applications is provided in which a first terminal (14) is formed around substantially the entire periphery of the device body and a second opposing polarity terminal (16) is formed by a through-via (22) located generally in the middle of the device body. In an alternative embodiment, a plurality of surface mount(MLC) devices are mounted to a circuit board in a diamond arr angement so as to allow contacts of one polarity to be electrically connected to terminals of similar polarity which are located substantially around the entire periphery of each device body. Contacts of opposing polarity may be electrically connected to through-via terminals located generally in the middle of each device body. In a third embodiment, a single surface mount MLC device is provided in which all electrical connections between the circuit board and the device are made by through-via terminals (38) which align with respective contacts on the circuit board.
申请公布号 WO02061774(A3) 申请公布日期 2002.09.19
申请号 WO2002US01979 申请日期 2002.01.24
申请人 AVX CORPORATION 发明人 MAKL, ALBERT, S., JR.
分类号 H01G4/06;H01G4/228;H01G4/232;H01G4/30;H01G4/35 主分类号 H01G4/06
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