发明名称 |
Printed wiring board structure with z-axis interconnections |
摘要 |
A structure of and method for producing a multilayer printed or wiring circuit board, and more particularly a method producing so-called z-axis or multilayer electrical interconnections in a hierarchial wiring structure in order to be able to provide for an increase in the number of inputs and outputs (I/O) in comparison with a standard printed wiring board (PWB) arrangement, and a printed wiring board produced by the method.
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申请公布号 |
US2002131229(A1) |
申请公布日期 |
2002.09.19 |
申请号 |
US20010812261 |
申请日期 |
2001.03.19 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
JONES GERALD W.;LAUFFER JOHN M.;MARKOVICH VOYA R.;MILLER THOMAS R.;PAOLLETTI JAMES P.;PAPATHOMAS KONSTANTINOS I.;STACK JAMES R. |
分类号 |
H05K1/11;H05K3/40;H05K3/46;(IPC1-7):F23Q3/01 |
主分类号 |
H05K1/11 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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