发明名称 |
Chipkartenmodul |
摘要 |
The invention relates to a chip card module with a semiconductor chip (1) on a substrate (2), which is characterized in that the thickness (3) of the semiconductor chip is smaller, preferably not more than half the thickness (4) of the substrate.
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申请公布号 |
DE10111028(A1) |
申请公布日期 |
2002.09.19 |
申请号 |
DE2001111028 |
申请日期 |
2001.03.07 |
申请人 |
INFINEON TECHNOLOGIES AG |
发明人 |
GUNDLACH, HARALD;PUESCHNER, FRANK |
分类号 |
G06K19/077;(IPC1-7):H01L23/13 |
主分类号 |
G06K19/077 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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