发明名称 Surface mountable polymeric circuit protection device and its manufacturing process
摘要 The present invention discloses a surface mountable polymeric circuit protection device. The surface mountable polymeric circuit protection device is formed by configuring a conductive polymeric element having PTC features in combination with a top electrode, a bottom electrode and an insulative layer therebetween without conductive mechanisms between the top and the bottom electrodes.
申请公布号 US2002130757(A1) 申请公布日期 2002.09.19
申请号 US20010999376 申请日期 2001.10.31
申请人 PROTECTRONICS TECHNOLOGY CORPORATION 发明人 HUANG CHIEN-SHAN;HWANG REN-HAUR;LIN CHEN-RON
分类号 H01C1/14;H01C1/148;H01C7/02;(IPC1-7):H01C7/10 主分类号 H01C1/14
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