| 摘要 |
PURPOSE: To bevel a silicon wafer with high quality by revealing the reality of metal pollution from a beveling wheel in beveling work of the wafer and eliminating the cause of the pollution. CONSTITUTION: Out of metal components contained in a metal bond of the beveling wheel, copper, nickel and zinc are revealed to be liable to diffuse in the wafer. In a beveling wheel 10 where an abrasive grain layer 2 with one or a plurality of grooves 3 is bonded to a peripheral portion of base metal 1, a bonding material in the abrasive grain layer 2 is a metal bond, and metal powder in the metal bond has a composition including none of copper, nickel and zinc.
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