发明名称 |
Circuit board and its manufacture method |
摘要 |
A protective agent 6 for protecting a wiring 1 is dispersed and placed in mottle-like on an interface between a via 3 and a wiring layer 2. Then, each dimension of interface regions 7 where the protective agent 6 does not exist is set to such a size that a plurality of conductive powders 4 constituting the via 3 can abutted on the wiring layer 2. Therefore, the plurality of conductive powders 4 and the wiring layer 2 are abutted each other in each interface region 7 where the protective agent 6 does not exist to electrically connect, thereby stabilizing the connection resistance for a prolonged period of time.
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申请公布号 |
US2002131248(A1) |
申请公布日期 |
2002.09.19 |
申请号 |
US20010986453 |
申请日期 |
2001.11.08 |
申请人 |
KOKUFU SHINOBU;SUZUKI TAKESHI;ECHIGO FUMIO;ANDOH DAIZO;OGAWA TATSUO;KAWAKITA YOSHIHIRO;TOMEKAWA SATORU |
发明人 |
KOKUFU SHINOBU;SUZUKI TAKESHI;ECHIGO FUMIO;ANDOH DAIZO;OGAWA TATSUO;KAWAKITA YOSHIHIRO;TOMEKAWA SATORU |
分类号 |
H05K3/28;H05K3/38;H05K3/40;H05K3/46;(IPC1-7):H05K1/00 |
主分类号 |
H05K3/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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