发明名称 Cleaning mixture - for removing protective resin films from electronic units
摘要 <p>Complex units of metal elements on the surface of a natural or synthetic resin support, are cleaned using a liquid mixture of (i) >=1 alcohol whose solubility parameter (delta) is clearly higher than that of the resin and (ii) >=1 H-bonding liquid solvent whose coefft. delta is reasonably lower than that of the resin to be removed, the ratio (i):(ii) being such as to give a coefft. delta close to that of the resin to be eliminated. The solvent does not attack the metal or support nor lower adherence between them. Alcohol (i) may be MeOH, EtOH, methyl glycol or an alcohol hydrate. Solvent (ii) ma be MeEt ketone, Me i-Bu ketone or Et amyl ketone.</p>
申请公布号 FR2112660(A5) 申请公布日期 1972.06.23
申请号 FR19700039746 申请日期 1970.11.05
申请人 UGINE KUHLMANN 发明人
分类号 C09D9/00;H05K3/28;(IPC1-7):08J1/00;11D7/00;05K3/00 主分类号 C09D9/00
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