| 摘要 |
A method and apparatus are provided for mounting a printed circuit board (PCB) in an optoelectronic transceiver housing. The mounting technique is quick, easy and requires no secondary adhesive or hardware. The PCB is mounted into an injection molded plastic housing that is plated with a conductive material. In its mounted state, the PCB deflects a spring feature of the housing such that the PCB is located securely therein. The PCB is preloaded against the plated plastic in order to electrically connect the PCB ground to the chassis ground.
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