| 摘要 |
<p>A method of manufacturing a semiconductor device capable of providing a highly reliable flip chip package by easily and properly sealing the package by an under-fill resin though an ultrasonic joining method is used and realizing an excellent fillet shape, comprising the first step for forming an under-fill resin layer (16) so as to cover a wiring pattern (12) on a circuit substrate (10), a second step for opposing a semiconductor chip (20) having projected electrodes (24) onto the wiring pattern (12) on the circuit substrate (10) and connecting the wiring pattern (12) to the projected electrodes (24) by giving ultrasonic vibration to the semiconductor chip (20) while pressing the projected electrodes (24) against the wiring pattern (12) through the under-fill resin layer (16), and the third process for hardening the under-fill resin layer (16) provided between the circuit substrate (10) and the semiconductor chip (20).</p> |
