发明名称 SEMICONDUCTING SHIELD COMPOSITIONS
摘要 <p>A conducting polymer composite comprising: (i) a phase I material consisting essentially of a polymer copolymer of ethylene and an unsaturated ester having 4 to 20 carbon atoms, said copolymer having a crystallinity of 0 to about 30 percent as determined by differential scanning calorimetry analysis and having a melt viscosity ηI; (ii) a phase II material having a crystallinity of 0 to about 30 percent as determined by differential scanning calorimetry analysis and having a melt viscosity of ηII, said phase II material consisting essentially of (A) a non-polar copolymer of ethylene, an alpha-olefin having 3 to 12 carbon atoms, and, optionally, a diene, or (B) a non-polar elastomer, either of which, when mixed with phase I material, will not enter into a completely homogeneous state, but is compatible with the phase I material; and (iii) a conducting filler material dispersed in the phase I material and/or the phase II in an amount sufficient to be equal to or greater than the amount required to generate a continuous conducting network in the phase I and phase II materials, with the proviso that the phase I and phase II materials, in the molten state, have the following relationship: (ηI÷ηII)x(VII÷VI)=0.5 to 2.0 wherein VI and VII are the volume fractions of the phase I and phase II materials, respectively, and VI+VII=1.</p>
申请公布号 WO2002073630(A2) 申请公布日期 2002.09.19
申请号 US2002006044 申请日期 2002.02.28
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