| 摘要 |
A composition comprising (A) a silanol group-bearing silicone resin comprising 30-100 mol % of T units: R1-SiZ3 and among the entire T units, 30-80 mol % of T-2 units containing only one silanol group: R1-Si(OH)Z'2 wherein R1 is a monovalent hydrocarbon group, Z is OH, hydrolyzable group or siloxane residue, at least one Z being a siloxane residue, and Z' is a siloxane residue, and having a number average molecular weight of at least 100, and (B) a polymer resulting from an acrylate and/or methacrylate monomer is applied to a substrate and heated above the decomposition temperature of polymer (B) to form a porous film. The porous film is flat and uniform despite porosity, and has a low permittivity and high mechanical strength. It is best suited as an interlayer insulating layer when used in semiconductor device fabrication.
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