Electronic component used as semiconductor comprises semiconductor chip having active front side with bond pads and covered with elastic layer provided with contacts electrically conductively connected to bond pads

摘要

An electronic component comprises a semiconductor chip (2) having an active front side with integrated switches and a passive rear side without integrated switches. The active front side has bond pads (4) and is covered with an elastic layer (10) provided with contacts (14) on the surface facing away from the active front side. Each contact is electrically conductively connected to at least one bond pad. An Independent claim is also included for the production of the above electronic component. Preferred Features: The elastic layer is a closed-pore elastomer and is an insulating layer acting as an electrical insulator.