发明名称 PACKAGING BUFFER MATERIAL
摘要 <p>A packaging buffer material produced by pulp molding, comprising a vertical buffer portion for contact with a packaged article from above or below, a lateral buffer portion for contact with the packaged article from the side, the lateral buffer portion being provided with a vertical projection having a vertically developed abutting surface for surface contact with the packaged article, and a reinforcing portion formed on the back side of the projection and having unevenness. The packaging buffer material is made using a relatively small amount of pulp, has a large buffering capacity though the buffer material is small in size, and gently embraces and protects the packaged article, thus preventing the occurrence of peeling, damaging or the like of the coatings on the packaged article.</p>
申请公布号 WO02072447(A1) 申请公布日期 2002.09.19
申请号 WO2002JP02358 申请日期 2002.03.13
申请人 SONY CORPORATION;YOSHIMURA, NAOMI 发明人 YOSHIMURA, NAOMI
分类号 B65D81/113;B65D81/05;(IPC1-7):B65D81/05;B65D77/26 主分类号 B65D81/113
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