发明名称 METHOD FOR RECOVERING MOLD RELEASE FILM
摘要 <p>PROBLEM TO BE SOLVED: To provide a method for recovering a mold release film, by which a mold release layer formed on the surface of the mold release film can readily be separated and removed to recover only a clean substrate film. SOLUTION: This method for recovering the mold release film is characterized by immersing a mold release film in which a mold release layer is formed on at least one side of a substrate through an easily dissolvable resin layer, after used, in a solvent capable of dissolving the easily dissolvable resin to dissolve the easily dissolvable resin in the solvent, whereby the mold release layer on the surface of the film is separated and removed to recover only the substrate film.</p>
申请公布号 JP2002265665(A) 申请公布日期 2002.09.18
申请号 JP20010068436 申请日期 2001.03.12
申请人 TORAY IND INC 发明人 KAWAZU YUKIO;YAMAUCHI HIDEYUKI;SUZUKI MOTOYUKI
分类号 B32B27/00;B32B27/08;C08J11/08;(IPC1-7):C08J11/08 主分类号 B32B27/00
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