发明名称 Module ejection mechanism
摘要 A lever 111 is pivotally mounted on the front face of a processing module or blade 101 for a computer, the lever having at least one projection 503 which cooperates with the edge of an aperture in a carrier for the module to eject/inject the module from/to its location in the carrier. Viewed from the front the lever may have an elongate X shape with the upper arms pivoted at 507 to a protrusion 532 which may have status indicator means for the module. The application also describes a casing for the module which has plastics and metal sections; the electronic components comprised by the modules; a cooling system in which a plenum may bypass the modules 101 at the front to cool support modules at the rear of the computer; and a power supply module with a sloping top wall defining a plenum.
申请公布号 GB0218592(D0) 申请公布日期 2002.09.18
申请号 GB20020018592 申请日期 2002.08.09
申请人 SUN MICROSYSTEMS, INC. 发明人
分类号 G06F1/18;H05K5/00;H05K5/02;H05K7/14;H05K7/20 主分类号 G06F1/18
代理机构 代理人
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