POLISHING METHOD FOR SEMICONDUCTOR WAFER AND POLISHING DEVICE THEREFOR

摘要

PROBLEM TO BE SOLVED: To provide a polishing method for a semiconductor wafer capable of improving shape accuracy of a polishing face. SOLUTION: When pressing the semiconductor wafer W onto a polishing cloth on a polishing surface plate through an elastic body by air to execute one-side polishing, the semiconductor wafer W is pressed by air supplied to a circular recessed part 4 open downward having a diameter larger than the wafer W through an elastic sheet 6 stretched in an opening end part of the recessed part 4 to airtightly close the recessed part 4, a support position P of the elastic sheet 6 in the opening end part of the recessed part 4 is adjusted vertically to the upper face of the semiconductor wafer W, and the one-side polishing is executed.