发明名称 BONDING METHOD FOR OBJECTS TO BE BONDED
摘要 PROBLEM TO BE SOLVED: To provide an easy-to-work bonding method for enabling the open time-free provisional bonding of an object to a substrate after the application of a curable composition on the object and/or on the substrate. SOLUTION: The bonding method is characterized in that no tacking is required when an object is landed for bonding after the application of a curable composition containing a reactive silicon group-containing polyoxyalkylene-based polymer with its extrudability not more than 30 seconds and with its initial tensile stress not less than 1 kPa.
申请公布号 JP2002265914(A) 申请公布日期 2002.09.18
申请号 JP20010064233 申请日期 2001.03.08
申请人 KANEGAFUCHI CHEM IND CO LTD 发明人 FUJIMOTO KAZUHIDE;ANDO KATSUHIRO;KONDO KENSUKE
分类号 C08G65/336;C09J5/00;C09J171/02;C09J183/06;(IPC1-7):C09J171/02 主分类号 C08G65/336
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