Semiconductor chip assemblies, methods of making same and components for same

摘要

Semiconductor chip assemblies incorporating flexible, sheetlike elements (42) having terminals thereon overlying the front or rear face of the chip to provide a compact unit. The terminals (48) on the sheetlike element are movable with respect to the chip, so as to compensate for thermal expansion. A resilient element such as a compliant layer (42) interposed between the chip and terminals permits independent movement of the individual terminals toward the chip driving engagement with test probe assembly so as to permit reliable engagement despite tolerances.