| 摘要 |
PROBLEM TO BE SOLVED: To provide a method capable of easily manufacturing an electroless plating base material having an excellent adhesion property of a plating film in an etching process step in the electroless plating method. SOLUTION: This electroless plating method comprises installing a solid dielectric substance to at least one opposite surface of a pair of electrodes facing each other at a pressure near atm. pressure, introducing treating gas between a pair of these opposite electrodes and subjecting the base material to be plated to contact treatment by the plasma obtained by impressing impulsive electric field, to these electrodes in the etching process step for the surface of the base material to be plated in the electroless plating method.
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