| 发明名称 |
RESIN COMPOSITION CONDUCTING HEAT WITH HIGH EFFICIENCY |
| 摘要 |
PROBLEM TO BE SOLVED: To obtain a resin composition for highly moisture-proof semiconductor chips, which conducts heat with a high efficiency. SOLUTION: This resin composition contains a synthetic resin and a heat- conductive filler. Here, the heat-conductive filler is aluminum nitride having an aluminum oxide-covered layer at the surface and is present at from 30 to 90 pts.wt. against 100 pts.wt. resin composition.
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| 申请公布号 |
JP2002265794(A) |
申请公布日期 |
2002.09.18 |
| 申请号 |
JP20010063856 |
申请日期 |
2001.03.07 |
| 申请人 |
NIIGATA PREFECTURE;FUKUYAMA HIROYUKI;NAMICS CORP |
发明人 |
YUDA TOSHIHIDE;ISOBE KINPEI;MARUYAMA HIDEKI;FUKUYAMA HIROYUKI;SUZUKI KENICHI;SUZUKI OSAMU;MURAMATSU KAZUO |
| 分类号 |
C08L101/00;C08K9/02;H01L23/29;H01L23/31;(IPC1-7):C08L101/00 |
主分类号 |
C08L101/00 |
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