| 摘要 |
PROBLEM TO BE SOLVED: To obtain a flame-retardant epoxy resin composition which has high flame retardance without using a halogen compound and a phosphorus based flame-retardant and, simultaneously, does not greatly reduce curability, flowability and moisture-resistant reliability, a semiconductor sealing material using the same, and to provide a semiconductor device. SOLUTION: The flame-retardant epoxy resin composition comprises, as the essential components, an epoxy resin having at least two epoxy groups in the molecule, a curing agent, an acetylacetonate metal complex represented by formula (1), and a compound in which a metallic atom and an aromatic compound or a heterocyclic compound are bonded by an ionic bond or a coordinate bond.
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