PREPREG HAVING HIGH FILLER CONTENT AND PRINTED CIRCUIT BOARD

摘要

PROBLEM TO BE SOLVED: To obtain a prepreg having good adhesion of a copper foil even when containing a large amount of an inorganic filler and a high-density printed circuit board provided by using the prepreg and having good strength in a resin composition prepared by compounding the filler. SOLUTION: A prepreg is prepared by using a fiber cloth base material, impregnating a thermosetting resin composition comprising 10-79 wt.% of the inorganic filler thereinto and drying. The objective prepreg is produced by arranging and adhering a material obtained by adhering a composition prepared by uniformly compounding 80-99 wt.%, preferably 81-95 wt.% of the nonconductive inorganic filler having 0.30-1.00 m<2> /g of specific surface area on a resin composition prepared by preferably compounding (b) an epoxy resin liquid at room temperature in an amount of 50-10,000 pts.wt. based on 100 pts.wt. of (a) a polyfunctional cyanate ester and essentially adding a thermosetting catalyst in an amount of 0.005-10 pts.wt. based on 100 pts.wt. of the (a)+(b) components as a thermosetting resin and forming B-stage on one side of a thermoplastic film so that the resin faces toward the prepreg on both sides of the prepreg. The high-density printed circuit board is provided by using the prepreg.