发明名称 CUTTING POSITION MARKING DEVICE AND CUTTING METHOD USING CUTTING POSITION MARKING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a practical cutting position marking device and a cutting method using the cutting position marking device usable for an existing cutting device, easily manufactured, constituted at a low cost and easily adjusting the desired cutting position of a cut object on a cutting-moving track of a cutting device provided with a rotary cutting edge put in derricking operation, for instance. SOLUTION: This cutting position marking device provided near a cutting device 1 provided with a rotary cutting edge 1A moved relatively to the cut object 3, is constituted by providing a device body 2 with a laser beam irradiation device 5 for irradiating the rotary cutting edge 1A of the cutting device 1 and the cut object 3 with wide-angle laser beams 4 of vertical plane shape.
申请公布号 JP2002264078(A) 申请公布日期 2002.09.18
申请号 JP20010064542 申请日期 2001.03.08
申请人 SANKYO GIKEN:KK 发明人 SUZUKI KUNIO
分类号 B25H7/04;B26D5/34;(IPC1-7):B26D5/34 主分类号 B25H7/04
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