| 摘要 |
PROBLEM TO BE SOLVED: To provide a polishing device for a wafer capable of maintaining an aligning state between the rotation center and the gravity center of the wafer, and smoothly moving a retention plate in the coming/going direction to a recessed part of an outer frame member. SOLUTION: In this polishing device, a polished face of the wafer W retained by the retention plate 10 is pressed by a prescribed press force, and the wafer W and a surface plate are relatively moved to polish the wafer W. The polishing device has the outer frame member 24 formed with the recessed part 26 for storing the retention plate 10 such that a retention face 11 of the retention plate 10 retaining the wafer W faces a polishing face of the surface plate; an elastic sheet 38 energizing and suspending the retention plate 10 to the storing direction into the recessed part 26; a space part 50 formed between the elastic sheet 38 and the bottom face of the recessed part 26, storing compressed air pushing out the retention plate 10 to the surface plate direction against energizing force of the elastic sheet 38; and plural balls 9 disposed between the peripheral face 10a of the retention plate 10 and the inner circumferential face 24a of the recessed part 26 such that the balls 9 simultaneously point- contact with both the faces 10a, 24a. |
