发明名称 HIGHLY DIELECTRIC, ADDITION-CURABLE COMPOSITION
摘要 PROBLEM TO BE SOLVED: To obtain a highly dielectric, addition-curable composition which is in a liquid state and is therefore easily handled without any solvent, shows a low moisture-absorption, exerts an excellent film-forming property and forms a cured product exerting excellent dielectric properties with a large dielectric constant and a small dielectric loss. SOLUTION: This composition contains (a) an organopolysiloxane containing a cyanoalkyl group and a monovalent hydrocarbon group having an aliphatic unsaturated bond, (b) a cyanoalkyl group-containing organohydrogenpolysiloxane and (c) a platinum group metal-based catalyst.
申请公布号 JP2002265788(A) 申请公布日期 2002.09.18
申请号 JP20010071761 申请日期 2001.03.14
申请人 SHIN ETSU CHEM CO LTD 发明人 KUDO MUNEO;YAMATANI MASAAKI
分类号 C08L83/07;C08F8/42;C08L83/05;C08L83/08;(IPC1-7):C08L83/07 主分类号 C08L83/07
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