发明名称 METHOD FOR MANUFACTURING SILVER COATED CONDUCTIVE POWDER, SILVER COATED CONDUCTIVE POWDER AND ELECTROLESS PLATING BATH FOR COATING CONDUCTIVE POWDER
摘要 PROBLEM TO BE SOLVED: To provide a method for manufacturing silver coated conductive powder which is capable of forming a uniform silver plating layer having a high adhesion property on a nickel alloy plating layer formed on the surface of a powdery core material even if a cyano compound is not used. SOLUTION: In this method for manufacturing the silver coated conductive powder by treating the surface of the core material consisting of an organic material or inorganic material with an electroless nickel-phosphorus plating liquid, then treating the surface with an electroless silver plating liquid containing a water-soluble silver salt and a complexing agent, an organic compound containing sulfurous acid or a sulfite or imide group or amide group is used as the complexing agent for the electroless silver plating liquid.
申请公布号 JP2002266079(A) 申请公布日期 2002.09.18
申请号 JP20010066073 申请日期 2001.03.09
申请人 SHIN ETSU CHEM CO LTD 发明人 KANEYOSHI MASAMI
分类号 C23C18/42;C23C18/52;(IPC1-7):C23C18/42 主分类号 C23C18/42
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