| 摘要 |
PROBLEM TO BE SOLVED: To obtain an epoxy resin composition which has good moldability and reliability, and no environmental problem, and additionally has excellent flame retardance, and to provide a semiconductor device using the same. SOLUTION: The epoxy resin composition comprises (A) an epoxy resin, (B) a phenolic resin, (C) an inorganic filler, and (D) a red phosphorus based flame-retardant obtained by covering the red phosphorus surface with a phenolic resin, aluminum hydroxide, and calcium or a zinc compound. The semiconductor device uses this composition.
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