发明名称 MOLD
摘要 PROBLEM TO BE SOLVED: To stably mold a molded product of high precision at a low cost even if the molded product has a thick wall or a non-uniform wall thickness shape. SOLUTION: When a molten resin injected in the cavity 7 formed by cavity pieces 2-4 to fill the cavity is cooled to the softening temperature of the resin, a gap is formed to the surface other than the transfer surface of the resin in the cavity to be cooled and the cooling speed of the gap 16 is made equal to that of other cavity surface to prevent the deformation of the molded product caused by the temperature distribution difference generated in the molded product.
申请公布号 JP2002264193(A) 申请公布日期 2002.09.18
申请号 JP20010071316 申请日期 2001.03.14
申请人 RICOH CO LTD 发明人 YAMANAKA YASUO;WATABE JUN;SAWADA KIYOTAKA
分类号 B29C45/73;B29C45/34;B29C45/72;B29C45/76;B29C45/78;(IPC1-7):B29C45/73 主分类号 B29C45/73
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