HEAT-RESISTANT ADHESIVE SHEET, METAL FOIL-CLAD LAMINATE AND CIRCUIT BOARD FOR AREA ARRAY SEMICONDUCTOR PACKAGE

摘要

PROBLEM TO BE SOLVED: To provide a heat-resistant adhesive sheet which suppresses the oozing of an adhesive from a warp-preventing surface and has excellent adhesivity between a substrate and a metal foil without deteriorating the heat resistance, moisture absorption resistance and reflow resistance of the adhesive sheet, to provide a metal foil-clad laminate using the heat-resistant adhesive sheet, and a circuit board for an area array semiconductor package. SOLUTION: This heat-resistant adhesive sheet is characterized by having a stage B heat-resistant adhesive composition on one side of a substrate and further having a heat-resistant adhesive composition comprising a polyamideimide resin and an epoxy resin and a phenolic resin as a thermosetting resin component on the other side.