| 摘要 |
Electric wires 20,21 are intersected with each other at right angles such that they are inclined with respect to the vibration direction X of ultrasonic vibration through 45{. Intersected portions C of the electric wires 20,21 are set between a horn-side chip 11 and an anvil-side chip 12 in a pressurized state, and ultrasonic vibration is input to the intersected portions C, thereby bonding the electric wires 20,21 to each other. One or both of the chips 11,12 comprises a grid of grooves (13a, figure 6) on its surface. The grooves are parallel with, and perpendicular to, the vibration direction X. |
