发明名称 CMP CONDITIONER
摘要 PROBLEM TO BE SOLVED: To improve acid resistance and corrosion resistance. SOLUTION: In this conditioner 20, plural abrasive grains 23 are fixed by a metallic bond phase 22 by plating. The metallic bond phase 22 is formed by forming an abrasive grain retention layer 25 of Ni or an Ni-based alloy on a base layer 24 for positioning and fixing the abrasive grains 23, and forming a ternary alloy layer 26 composed of the balance Ni-5 to 15 wt.% W-5 to 15 wt.% P as an outermost layer. The ternary alloy layer 26 is formed by electroless plating. Preferably, the conditioner 20 is heat treated at 300-600 deg.C.
申请公布号 JP2002264014(A) 申请公布日期 2002.09.18
申请号 JP20010070209 申请日期 2001.03.13
申请人 MITSUBISHI MATERIALS CORP 发明人 NAKABAYASHI AKIRA
分类号 B24B53/12;B24B53/017;H01L21/304 主分类号 B24B53/12
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