EPOXY ADHESIVE FILM AND METHOD FOR BONDING

摘要

PROBLEM TO BE SOLVED: To provide an adhesive film applicable at low temperature and capable of withstanding fine punching and a method for precise bonding by using the film. SOLUTION: The film is an epoxy adhesive film made mainly of an epoxy polymer having a weight-average molecular weight of 70,000 or higher produced by polymerization of a bifunctional epoxy resin and bifunctional phenols.