ELECTROPLATING METHOD AND ELECTROPLATING APPARATUS

摘要

PROBLEM TO BE SOLVED: To provide an electroplating method which prevents remaining of air bubbles from first treatment by subjecting areas to be plated to chemical treatment from the state that these areas are not exposed to air and makes it possible to obtain high-quality plating with high accuracy even in the areas to be plated which are increasingly made fine and to provide an electroplating apparatus. SOLUTION: The electroplating method which deposits metal on the surfaces of conductors exposed by forming a photosensitive resin film on the surface of the conductors and subjects this film to exposing and developing comprises treating the areas to be plated while maintaining these areas in a wet state at all times in a process step from developing of the photosensitive resin to plating of a metal. The electroplating apparatus comprises plural continuous chemical treatment process steps in which the first process step is the development process step.