SEED LAYER RESTORATION BATH

摘要

PROBLEM TO BE SOLVED: To provide an electroplating bath for enhancing a copper seed layer and for subsequent metallization on the seed layer. SOLUTION: A deposited metallic seed layer which is substantially free of discontinuity is obtained on a substrate by a process step including bringing of the metallic seed layer deposited on the substrate into contact with an alkaline copper electroplating bath containing copper pyrophosphate. The electroplating bath has pH 8 to 9, further contains a complexing agent and further contains >=1 base selected from ammonium hydroxide or tetraalkylammonium hydroxides.