| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition for sealing photosemiconductors which excels in transparency, mold release characteristics, flowability, and soldering resistance, and a photosemiconductor device sealed with its cured product of the epoxy resin composition. SOLUTION: The epoxy resin composition for sealing photosemiconductors comprises (A) an epoxy resin, (B) an acid anhydride curing agent, (C) a curing accelerator, (D) a specific mold release agent, (E) a compatibilizing agent composed of a a glycerin ester of a 12-26C fatty acid, and (F) a filler as the essential components, and the filler (F) being glass particles having SiO2 , CaO, and Al2 O3 as the major components, and simultaneously, it is characterized in that the difference in refractive index between the cured product of a composition composed of the above described components excluding component (F) and the filler (F) being not greater than 0.01. The photosemiconductor device is sealed with a cured product of this composition.
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