| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for the finish treatment of a resin molded electronic part for precisely removing the excess resin or impurities adhering to the metal lead part of the resin molded electronic part having the metal lead part, and the resin molded electronic part obtained by this method. SOLUTION: After the resin molded electronic part 1 having the metal lead part 2 is molded, metal particles are ejected to the surface of at least the lead part 2 thereof under an ejection condition preventing the deformation of the lead part 2 and the damage of solder wettability thereof by a dry ejection method to remove the excess resin and impurities such as a release agent or the like adhering to the lead part 2. The resin molded electronic part subjected to finish treatment so as to have the metal lead part free from the excess resin or impurities such as the release agent or the like is also disclosed.
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